Commit b5b0050b authored by schneider's avatar schneider
Browse files

feat(rev2): Update PCB infos

parent b112bf12
- 4 Layers
- 45 mm x 38 mm
- Through vias: 450 um diameter (200 um drill)
- Micovias: 300 um diameter (100 um drill)
- Buried vias: 450 um diameter (200 um drill)
- Buried vias are offset to microvias
- Microvias Filled & Capped (for BGA soldering)
- 100 um smallest width
- 100 um smallest spacing
- 35 um copper
- ENIG
- Thickness: 1.0 mm
- Layer count: 4
- Size: 45 mm x 38 mm
- Track width: 100 um
- Track clearance: 100 um
- Through vias: 450 um diameter (200 um drill)
- Microvias: 300 um diameter (100 um drill)
- Buried vias: 450 um diameter (200 um drill)
- Buried vias are offset to microvias
- Microvias Filled & Capped (for BGA soldering)
- Prepreg thickness: 80 um +- 15 um (for microstrip line)
- Copper thickness: 35 um
- Silkscreen: double sided, white
- ENIG
- Total PCB thickness: 1.0 mm
- Layer count: 4
- Size: 46 mm x 36 mm
- Track width: 120 um
- Track clearance: 120 um
- Drill size: 0.2 mm
- Annular ring: 0.125 mm (via diameter: 0.45 mm)
- Stack-up not critical
- Copper thickness: 35 um
- Silkscreen: single sided, white
- ENIG
- Total PCB thickness: 1 mm
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