Commit b112bf12 authored by schneider's avatar schneider
Browse files

change(rev2): Add Readme with PCB requirements for Fundamental Board

parent 1b86ba03
- 4 Layers
- 45 mm x 38 mm
- Through vias: 450 um diameter (200 um drill)
- Micovias: 300 um diameter (100 um drill)
- Buried vias: 450 um diameter (200 um drill)
- Buried vias are offset to microvias
- Microvias Filled & Capped (for BGA soldering)
- 100 um smallest width
- 100 um smallest spacing
- 35 um copper
- ENIG
- Thickness: 1.0 mm
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